3-D chip, up close, part 2

Looking at a larger image, you can see three different detector types, distinguished here by their patterns of contacts. One is for the CMS upgrade, another is for a lepton collider, and the third is for X-ray correlation spectroscopy. Fermilab is behind the novel concept of the detector devices and design, which are known as 3-D integrated chips, and company Tezzaron fabricated them. Brookhaven National Laboratory built the sensor. Photo: Reidar Hahn

Looking at a larger image, you can see three different detector types, distinguished here by their patterns of contacts. One is for the CMS upgrade, another is for a lepton collider, and the third is for X-ray correlation spectroscopy. Fermilab is behind the novel concept of the detector devices and design, which are known as 3-D integrated chips, and company Tezzaron fabricated them. Brookhaven National Laboratory built the sensor. Photo: Reidar Hahn (see part 1)