3-D chip, up close, part 1

Each of the integrated circuits you see here is about 6 millimeters on a side and projects one one-thousandth of an inch above the surface of the larger sensor wafer on which it sits, together forming a functional detector. Although it may be hard to believe, each device is made of two incredibly thin circuit layers and a purposely thicker sensor tier, stacked much like the layers of a cake. The layers are fused together with a special glue called DBI, developed by Ziptronix. Tiny tungsten finger-like projections (not seen) run vertically through the layers to provide electrical inter-tier connections. Photo: Reidar Hahn  (see part 2)

Each of the integrated circuits you see here is about 6 millimeters on a side and projects one one-thousandth of an inch above the surface of the larger sensor wafer on which it sits, together forming a functional detector. Although it may be hard to believe, each device is made of two incredibly thin circuit layers and a purposely thicker sensor tier, stacked much like the layers of a cake. The layers are fused together with a special glue called DBI, developed by Ziptronix. Tiny tungsten finger-like projections (not seen) run vertically through the layers to provide electrical inter-tier connections. Photo: Reidar Hahn (see part 2)